2026-11-08
Micro Magnetics’ SpinTron series magnetron sputtering sources are offered for laboratory and industrial thin-film deposition, where system performance directly affects film quality and production efficiency. The line is built around a circular rare-earth permanent-magnet configuration and is designed to accommodate a range of target sizes and materials.
Core technical advantages
The SpinTron sputtering gun uses a circular rare-earth NdFeB permanent-magnet configuration. The internal magnetic-field design is intended to optimize plasma distribution and support high film uniformity.
The design also aims to improve target utilization, a factor that can reduce consumable costs over long production runs. Those characteristics are central to the system’s stated performance profile.
Multiple sizes and high compatibility
The SpinTron line is available in several sizes to address different research and industrial requirements. Targets can range from 1 inch to 6 inches, and the system is designed to handle metallic and insulating targets as well as magnetic and non-magnetic materials.
The series is offered in the following configurations.
| Parameter | Specification |
|---|---|
| Available sizes | 1, 2, 3, 4, and 6 inches |
| Magnet configuration | Circular rare-earth NdFeB permanent magnets |
| Target compatibility | Metallic/insulating; magnetic/non-magnetic |
Reliable engineering design
Beyond process performance, the system is designed with installation and maintenance in mind. The structure is described as simple, allowing for straightforward setup and efficient routine operation and maintenance.
Manufacturing quality is intended to ensure stability during extended continuous operation. The design is positioned for thin-film preparation where consistent operation is required.
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