Spintron Magnetron Sputtering Sources Improve Thin Film Deposition Precision

Core technical advantages

The SpinTron sputtering gun uses a circular rare-earth NdFeB permanent-magnet configuration. The internal magnetic-field design is intended to optimize plasma distribution and support high film uniformity.

The design also aims to improve target utilization, a factor that can reduce consumable costs over long production runs. Those characteristics are central to the system’s stated performance profile.

Multiple sizes and high compatibility

The SpinTron line is available in several sizes to address different research and industrial requirements. Targets can range from 1 inch to 6 inches, and the system is designed to handle metallic and insulating targets as well as magnetic and non-magnetic materials.

The series is offered in the following configurations.

Reliable engineering design

Beyond process performance, the system is designed with installation and maintenance in mind. The structure is described as simple, allowing for straightforward setup and efficient routine operation and maintenance.

Manufacturing quality is intended to ensure stability during extended continuous operation. The design is positioned for thin-film preparation where consistent operation is required.